TMS 2015 Course Offerings
11th Annual Lead-Free Solders and Interconnect Technology Workshop
Additive Manufacturing Materials and Processes Workshop
Aluminum Melting Workshop
Explore the Use of the CALPHAD Modeling Tools for Your Daily Practice
Characterization Techniques for Magnetic Materials Workshop
Friction Stir Welding and Processing Short Course
Mentorship for Young Scientists: Developing Scientific Survival Skills Workshop
Multiphysics Materials Simulations using the Open Source MOOSE Framework Workshop
Supplier Technology Workshop – Anode Carbon
Supplier Technology Workshop – Reduction
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| Title | 11th Annual Lead-Free Solders and Interconnect Technology Workshop |
| When | Sunday, March 15, 2015, 9:00 a.m. to 5:00 p.m. |
| Where | Mockingbird 2, Swan Hotel |
| Sponsorship | TMS Functional Materials Division (formerly EMPMD) |
| Workshop Length | Full-day |
| Flyer |  View / Download |
COURSE OVERVIEW
This annual Lead-Free Solders and Interconnect Technology Workshop provides latest development and research studies on interconnect materials and electronic packaging technologies. Due to the light-weight and multi-functional trends for electronic packages, the key materials used in different levels of packaging have dramatically changed or experienced severe service conditions. A lot of new interconnect material series, such as emerging lead-free solders, have been developed and reported in the past lead-free solder workshops. Meanwhile, their reliability issues have been deeply discussed within this workshop. Researchers in this fields have agreed that fundamental studies are needed to go further in materials perspective of view in order to improve the service capability of the new materials and assemblies. This year’s work shop will focus on several fundamentals studies on Sn-based interconnect materials, especially the fundamental materials issues that affect their reliability
performance, such as whisker formation, mechanical behavior, etc.
Agenda
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Time
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Keynote Speakers
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Topic
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8:30 – 8:50
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- Registration -
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8:50 – 9:00
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- Opening remarks -
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9:00 – 9:50
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Prof. Carol Handwerker
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Whisker Nucleation and Growth under Different Conditions of Stress
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9:50 – 10:10
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- Coffee break -
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10:10 – 11:00
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Dr. Polina Snugovsky
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Electronic Assembly and Whisker Formation: Effect of Cleanliness
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11:00 – 11:50
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Prof. Eric Chason
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Sn Whisker Formation as a Stress-Induced Nucleation and Growth Process
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11:50 – 2:00
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- Lunch break -
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2:00 – 2:50
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Prof. Sinn-wen Chen
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Phase Diagrams and Electronic Soldering
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2:50 – 3:00
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- Coffee break -
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3:00 – 3:50
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Dr. Philip. Eisenlohr
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Modeling of Heterogeneous Anisotropic Deformation of Tin-Based Solder Joints
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3:50 – 4:40
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Prof. Albert Wu
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Massive Spalling of IMCs in Pb-free Solders on Co-based Surface Finishes
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4:40 – 5:00
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- Panel Discussion -
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REGISTRATION INFORMATION
REGISTRATION FEES *
Before February 9, 2015
- Member $15
- Nonmember $125
- Student $15
After February 9, 2015
- Member $25
- Nonmember $175
- Student $125
* Registration fees include a beverage break.
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