Temperature cycling test and statistical analysis of various high-density packages on PCBs with SnCu HASL, NiAu, and OSP finishes are investigated in this study, the full text of which is provided. Emphasis is placed on the determination of the life distriubtion and reliability of the lead-free solder joints of these high-density package assemblies while they are subjected to temperature conditions. A data acquisition system, failure criterion, and data extraction method will be presented and examined. The life test data is best fitted to the Webull distribution. Also, the sample mean, population mean, sample characteristic life, true characterist life, sample Weibull slope, and true Weibull slope for some of the high-density packages are provided and discussed. Furthermore, the relationship between the reliability and the confidence for a life distribution is established. Finally, the confidence for comparing the quality (mean life) of lead-free solder joints of high-density packages are determined.

LAST UPDATE: 2/12/2007

SOURCE: Lau, John. "Reliability Testing and Data Analysis of High-Density Packages' Lead-Free Solder Joints." IPC SMEMA Council APEX 2003. Anaheim, CA. 31 March-2 April 2003.

LINK: Reliability Testing and Data Analysis of High-Density Packages' Lead-Free Solder Joints