Active maintenance of these web resources ceased in 2012 and they will not be updated. They are posted for archival purposes only. |
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WEB RESOURCE: NIST Recommended Practice Guide:Test Procedures for Developing Solder Data
 Documents a wide variety of standardized test procedures that can produce valid and reproducable data
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WEB RESOURCE: Accelerated Reliability Testing and Analysis of Lead-Free Interconnects
An interim status report of the HDPug GPLF project on Pb-free solder interconnects
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BOOK: Mechanics of Solder Alloy Interconnects
Resource to be used in developing a solder joint reliability assessment
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ARTICLE: Pb-free Solders for Flip-Chip Interconnects
This article reviews the physical metallurgy and mechanical metallurgy of lead-free solders
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WEB RESOURCE: Reliability Testing and Data Analysis of High-Density Packages' Lead-Free Solder Joints
Study on Temperature cycling test and statistical analysis of various high-density packages on PCBs with SnCu HASL, NiAu
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WEB RESOURCE: Reliability Test Matrices for Lead-Free Solder Evaluation: Project #1
A test matrix for reliability testing
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WEB RESOURCE: MPP5.2: Measuring and Modelling the Materials Properties Impact on Solder Joint Reliability
Interactive flowchart summary of project MPP5.2, conducted by the UK's National Measureent Laboratory
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BOOK: Solder Mechanics: A State of the Art Assessment
Summation of work in solder research
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