Active maintenance of these web resources ceased in 2012 and they will not be updated. They are posted for archival purposes only.

Topic Title: WEB RESOURCE: Reliability Test Matrices for Lead-Free Solder Evaluation: Project #1
Topic Summary: A test matrix for reliability testing
Created On: 2/12/2007 9:24 AM
2/12/2007 9:24 AM


Todd Osman

Posts: 219
Joined: 2/2/2007

A test matrix for reliability testing with the following objectives: 1) Determine the moisture and temperature sensitivity of package types to 260 degrees C preconditioning temperature; 2) Determine sensitivity of key device types to 260 degrees C preconditioning temperature.

LAST UPDATE: 2/12/2007

SOURCE: "Reliability Test Matrices for Lead-Free Solder Evaluation: Projec #1." AMD Worldwide. 17 October 2002. Advanced Micro Devices. 22 Jan 2007. Advanced Micro Devices

LINK: Reliability Test Matrices for Lead-Free Solder Evaluation: Project #1
       
FORUMS > SOLDER MECHANICS AND RELIABILITY TESTING

THE MINERALS, METALS & MATERIALS SOCIETY
5500 Corporate Drive Suite 750, Pittsburgh, PA 15237 USA (directions)
www.tms.org 		Telephone 800-759-4867 (U.S. and Canada)
724-776-9000 (elsewhere)
Fax 724-776-3770 ·Email webmaster@tms.org