"An interactive flowchart summary of project MPP5.2, conducted by the UK's National Measureent Laboratory. Clicking on various highlighted portions of the flowchart will access abstracts and/or papers on that particular aspect of the project. The purpose of this project is to develop a tool kit of models and test methods for the better understanding of lead-free solder joint reliability. Its main objective is to characterise fatigue damage in solder joints."

LAST UPDATE: 2/12/2007

SOURCE: "MPP5.2: Measuring and Modelling the Materials Properties Impact on Solder Joint Reliability." The UK's National Measurement Laboratory. 2007. National Physical Laboratory. 22 Jan 2007.

LINK: MPP5.2: Measuring and Modelling the Materials Properties Impact on Solder Joint Reliability