About the 1997 Electronic Materials Conference

Sponsored by the Electronic Materials Committee of The Minerals, Metals & Materials Society's (TMS's) Electronic, Magnetic & Photonic Materials Division, the 39th Electronic Materials Conference (EMC) will be held June 25-27, 1997, at Colorado State University, Fort Collins, Colorado. This conference provides a forum for topics of current interest and significance on the areas of preparation and characterization of electronic materials. Individuals actively engaged or interested in electronic materials research and development are encouraged to attend this meeting. This year's EMC is again being coordinated with the Device Research Conference (DRC) of the Institute of Electrical and Electronics Engineers, which will be held at the same location, Monday through Wednesday, June 23-25, 1997.

INVITED ORGANIZERS FOR THE 1997 EMC

Carol Ashby, Sandia National Labs; Dubrovko Babic, Hewlett Packard; James Cooper, Purdue University; Steven P. DenBaars, University of California; Russell D. Dupuis, University of Texas at Austin; Jacek K. Furdyna, University of Notre Dame; Mark S. Goorsky, University of California; Eric S. Harmon, Mellwood Labs Inc.; Julia W.P. Hsu, University of Virginia; Kirk D. Kolenbrander, Massachusetts Institute of Technology; Kei Maya Lau, University of Massachusetts; Hiroyuki Matsunami, Kyoto University; Theresa S. Mayer, Penn State University; Richard H. Miles, SDL, Inc.; Robert Mirin, NIST; Umesh K. Mishra, University of California; Robert J. Nemanich, North Carolina State University; Pierre M. Petroff, University of Maryland; Steven A. Ringel, Ohio State University; James S. Speck, University of California; Maria Tamargo, City College of New York; Michael A. Tischler, Epitronics; Clivia Sotomayor Torres, Bergische Universitat GH Wuppertal; Parvez Uppal, Sanders, Lockheed Martin; Gary W. Wicks, University of Rochester; Laura Ann Wills, Hewlett Packard; Ya-Hong Xie, AT&T Bell Labs; Yang Yang, University of California at Los Angles; Edward T. Yu, University California

ELECTRONIC MATERIALS COMMITTEE

OFFICERS: Timothy Sands, chair, University of California; Charles Tu, treasurer, University of California at Berkeley; Jerry Woodall, past chair, Purdue University; Michael Melloch, secretary, Purdue University; Thomas Kuech, vice chair, University of Wisconsin; T.C. Harman, JEM editor, Massachusetts Institute of Technology, Lincoln Laboratory; MEMBERS: Ilesamni Adesida, University of Illinois; Rajaram Bhat, Bellcore; Robert Biefeld, Sandia National Laboratories; Dieter Bimberg, Technical University, Berlin; April Brown, Georgia Institute of Technology; P. Daniel Dapkus, University of Southern California; Ralph Dawson, Sandia National Laboratories; Randall Feenstra, Carnegie Mellon University; Eugene Fitzgerald, Massachusetts Institute of Technology; Darrel Frear, Sandia National Laboratory; Robert Gunshor, Purdue University; Evelyn Hu, University California; Vassilis Keramidas, Bellcore; L.C. Kimerling, Massachusetts Institute of Technology; Leslie Kolokziejski, Massachusetts Insitutue of Technology; Francoise Legoues, IBM Corporation; James Merz, University of Notre Dame; Theodore Moustakas, Boston University; Diego Olego, Phillips Laboratories; Fred Pollak, Brooklyn College of City University of New York; Michael Spencer, Howard University; Akio Saski, Osaka Electro-Communication University; Gregory Stillman, University of Illinois; Steve Stockman, Hewlett-Packard Co.; James Sturm, Princeton University; Ray Tsui, Motorola, Inc.; Chris Van de Walle, Xerox Palo Alto Research Center; Kang Wang, University of California; Bruce Wessels, Northwestern University; Arthur Willoughby, Southampton University; Alex Zunger, NREL