Issues for Wide Bandgap Materials
Nanoscale Science and Technology in Materials
Additional Topic Areas
Other/New Areas

• Group III-Nitrides: Growth, Processing, Characterization, Theory and Devices
  • Andrew Allerman, Sandia National Laboratories
  • Russell Dupuis, Georgia Institute of Technology
  • Randy Feenstra, Carnegie Mellon University
  • Jung Han, Yale University
  • Michael Manfra, Bell Labs, Lucent Technologies
  • Thomas Myers, West Virginia University
    
    
• Zinc Oxide: Growth, Doping, Defects, Nanostructures and Devices
  • Julia Hsu, Sandia National Laboratories
  • Tom Jackson, The Pennsylvania State University
  • Maria Losurdo, Institute of Inorganic Methodologies and Plasmas
  • Yicheng Lu, Rutgers University
  • Shelby Nelson, Eastman Kodak Company
  • David Norton, University of Florida
  • Jamie Phillips, University of Michigan
    
    
• Silicon Carbide: Growth, Processing, Characterization, Theory and Devices
  • Michael Capano, Purdue University
  • Stephen E. Saddow, University of South Florida
  • Robert Stahlbush, Naval Research Laboratory
    
    
• Point Defects, Extended Defects and Doping in Wide Bandgap Materials
  • Leonard Brillson, The Ohio State University
  • Shigefusa Chichibu, Tohoku University
  • James Speck, University of California
  • Christian Wetzel, Rensselaer Polytechnic Institute
  • Huili Xing, University of Notre Dame

• Low-Dimensional Structures: Quantum Dots, Wires and Wells
  • Diana Huffaker, University of New Mexico
  • Jim Merz, University of Notre Dame
  • Mark Miller, University of Utah
  • Akio Sasaki, Osaka Electro-Communication University
  • Ben Shanabrook, Naval Research Laboratory
  • Glenn Solomon, NIST
• Nanoscale Characterization: Scanning Probes, Electron Microscopy and Other Techniques
  • Rachel Goldman, University of Michigan
  • Julia Hsu, Sandia National Laboratories
  • Susanne Stemmer, University of California
  • Edward Yu, University of California
• Molecular Electronics: Devices, Materials and Contacts
  • Mark Hersam, Northwestern University
  • David Janes, Purdue University
  • Gregory Lopinski, Steacie Institute for Molecular Sciences
  • Theresa Mayer, The Pennsylvania State University
  • Shalom Wind, Columbia University
• Nanotubes and Nanowires
  • Kris Bertness, National Institute of Standards and Technology
  • Theresa Mayer, The Pennsylvania State University
  • Hou T. Ng, Hewlett-Packard Company
  • Timothy Sands, Purdue University
  • Raymond Tsui, Motorola
• Chemical and Biological Sensors: Materials, Interfaces and Integration
  • April Brown, Duke University
  • David Janes, Purdue University
  • Laura Rea, U.S. Air Force Research Laboratory
  • Albert Alec Talin, Sandia National Laboratories
  • Lloyd Whitman, Naval Research Laboratory
  • William Wong, Palo Alto Research Center

• Contacts to Semiconductor Epilayers, Nanowires, Nanotubes and Organic Films
  • Suzanne Mohney, The Pennsylvania State University
  • Lisa Porter, Carnegie Mellon University
  • Tae-Yeon Seong, Korea University
  • Jerry Woodall, Purdue University
• Epitaxy
  • April Brown, Duke University
  • Diana Huffaker, University of New Mexico
  • Amy Liu, IQE Inc.
• Epitaxy for Devices
  • Archie Holmes, University of Virginia
  • Kei-May Lau, Hong Kong University of Science and Technology
  • Charles Lutz, Kopin Corporation
  • Michael Tischler, Ocis Technologies
• Epitaxy: Configurable 3-D, Metamorphic and Template Growth (Other Areas)
  • Ralph Dawson, University of New Mexico
  • Alan Doolittle, Georgia Institute of Technology
  • Steven Ringel, The Ohio State University
  • Christine Wang, Massachusetts Institute of Technology
• Point and Extended Defects in Mismatched Materials
  • Eugene Fitzgerald, Massachusetts Institute of Technology
  • Steven Ringel, The Ohio State University
  • Jerry Woodall, Purdue University
• Nondestructive Testing and In Situ Monitoring and Control
  • Kurt Eyink, U.S. Air Force Research Laboratory
  • Mark Goorsky, University of California
  • Andrew Hoff, University of South Florida
• Semiconductor Processing: Oxidation, Passivation, Functionalization and Etching
  • Michael Capano, Purdue University
  • Douglas Hall, University of Notre Dame
  • Maria Losurdo, Institute of Inorganic Methodologies and Plasmas
  • Suzanne Mohney, The Pennsylvania State University
• Materials Integration: Wafer Bonding and Engineered Substrates
  • Harry Atwater, California Institute of Technology
  • Karl Hobart, Naval Research Laboratory
  • Archie Holmes, University of Virginia
  • Thomas Kuech, University of Wisconsin
  • Peter Moran, Michigan Technological University
• Oxide Thin Film Integration: Alternative Dielectrics, Epitaxial Oxides and Metal Gates
  • Evgeni Gusev, Qualcomm MEMS Technologies
  • Pat Lenahan, The Pennsylvania State University
  • Maria Losurdo, Institute of Inorganic Methodologies and Plasmas
  • Peter Moran, Michigan Technological University
  • Shriram Ramanathan, Harvard University
  • Susanne Stemmer, University of California
• Si-Based Heterojunctions
  • Eugene Fitzgerald, Massachusetts Institute of Technology
  • Sarah Olsen, University of Newcastle-upon-Tyne
  • Michael Tischler, Ocis Technologies
  • Ya-Hong Xie, University of California
• Narrow Bandgap Semiconductors: Antimonides and Other Materials
  • Brian Bennett, Naval Research Laboratory
  • Robert Biefeld, Sandia National Laboratories
  • Ralph Dawson, University of New Mexico
  • Christine Wang, Massachusetts Institute of Technology
• Indium Nitride: Growth, Processing, Characterization, Theory and Devices
  • Debdeep Jena, University of Notre Dame
  • Yasushi Nanishi, Ritsumeikan University
  • Joan Redwing, The Pennsylvania State University
  • William Schaff, Cornell University
• Spin-Dependent (or Spintronic) Electronic Materials
  • Michael Flatte, University of Iowa
  • Xinyu Liu, University of Notre Dame
  • Chris Palmstrom, University of California, Santa Barbara
  • Nitin Samarth, The Pennsylvania State University
  • Masaaki Tanaka, University of Tokyo
• Dilute Nitride Semiconductors
  • Rachel Goldman, University of Michigan
  • Douglas Hall, University of Notre Dame
  • Archie Holmes, University of Virginia
  • Thomas Kuech, University of Wisconsin
  • Charles Tu, University of California
• Flexible Thin-Film Electronics
  • David Gundlach, National Institute of Standards and Technology
  • Thomas Jackson, The Pennsylvania State University
  • Thomas Kuech, University of Wisconsin
  • William Wong, Palo Alto Research Center
• Organic Thin Film and Crystalline Transistors: Devices, Materials and Processing
  • David Gundlach, National Institute of Standards and Technology
  • Tom Jackson, The Pennsylvania State University
  • Alberto Salleo, Palo Alto Research Center
• Organic-Inorganic Hybrid Photovoltaics
  • David Gundlach, National Institute of Standards and Technology
  • Julia Hsu, Sandia National Laboratories
  • Max Shtein, University of Michigan
• Materials and Novel Concepts for UV Detectors and Emitters
  • Laura Rea, U.S. Air Force Research Laboratory
  • Jerry Woodall, Purdue University
  • Mike Wraback, U.S. Army Research Laboratory

• Compound Semiconductor Growth on Si Substrates
  • Ralph Dawson, University of New Mexico
  • Gene Fitzgerald, Massachusetts Institute of Technology
  • Jerry Woodall, Purdue University
• Fuel Cell and Battery Materials
  • Stephen Hackney, Michigan Technological University
  • Peter Moran, Michigan Technological University
• Solar Cell Materials and Devices
  • Mark Goorsky, University of California
  • Debdeep Jena, University of Notre Dame
  • Glenn Solomon, NIST
  • Christian Wetzel, Rensselaer Polytechnical Institute
  • Jerry Woodall, Purdue University
• Graphene and Carbon Nanotubes
  • Randy Feenstra, Carnegie Mellon University
  • Tom Jackson, The Pennsylvania State University
  • Debdeep Jena, University of Notre Dame
  • Mark Miller, University of Utah
  • Randy Sandhu, Northrop Grumman Space Technology
  • Glenn Solomon, NIST
• Thermoelectrics and Thermionics
  • Mayank Bulsara, Massachusetts Institute of Technology
  • Rachel Goldman, University of Michigan
  • Timothy Sands, Purdue University
  • Jeff Snyder, California Institute of Technology
• Joint Session with DRC
  • Steven Koester, IBM TJ Watson Research Center

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