Progress in Lead-Free Solders is a webinar that takes place Tuesday, October 23rd.

The event consists of two elements:

1. Three presentations
2. Q&A managed via this discussion board within Materials Technology@TMS.

The presentations will be privately recorded early in the day of the 23rd and then made available for playback by registrants immediately afterward. The presentations will be recorded rather than broadcast live for two reasons:

1. To avoid the possibility of users encounter technical glitches with their connections that may impare their ability to experience the presentations.
2. To recognize that all potential participants worldwide cannot all be available for a fixed-time live event

To keep the interactivity element of the event intact, webinar presenters will monitor this discussion for two months after the event and respond to postings/discussions that may appear here as appropriate.

Technically, you do not have to participate in the webinar to participate in the discussion. However, the discussion should be focused on the speakers' presentations. If you wish to view the presentations, the webinar is always available for rebroadcast. See this page for access details:

http://www.tms.org/meetings/webcast/pbfree07/home.html

BACKGROUND ON THE EVENT

WEBINAR SCOPE

Learn about . . . progress in the implementation of lead-free solders from both the industrial and academic perspectives. Industrial use of lead-free solders, work on combating tin whiskers, and the role of solder in three-dimensional packaging are among the topics that will be covered in this two-hour webinar.

Get Answers . . . to your specific questions about lead-free solder progress during the interactive question-and-answer session.

PLANNED TOPICS

Progress in Tin Whiskers
Presenter: Carol Handwerker, Purdue University

Progress on Industrial use of Lead-free Solders
Presenter: David Hillman, Rockwell Collins

Lead-Free Solders and 3D Packaging
Presenter: Dongkai Shangguan, Flextronics

WEBINAR SPONSORS

This webinar is presented by JOM.

The research presented in this program is sponsored in part by Surface Mount Technology Association.