While substantial improvements have been made with fiber treatment, the prototype is not immediately ready for use as an FR4 PCB. To a minor degree, testing and developmental work remains to prove material performance in this application. The properties of dielectric breakdown, arc resistance, and moisture absorption should be examined in more detail to determine what prototype adaptations can be made to remedy current shortcomings. It is probable that simple changes in factors such as resin content or fiber weave would have an influence on these properties, and therefore deserve further examination. In addition, the behavior of the present prototype in response to PCB processing steps including drilling, plating, resist application and removal, etching, and soldering should also be investigated. One of the key hurdles in industrial implementation is the successful adoption and/or use of the design in a real electronics application. For this we will need to establish a relationship with an industrial partner.
