The electronics industry sector faces twin challenges arising from the transition to environmentally-benign solder alloys and the necessity to maintain structural integrity and reliability in the face of continuing miniaturisation. This book addresses the situation from a multidisciplinary teaching perspective. The authors' expertise in materials, electronics manufacture and design are integrated throughout to establish a common platform and language for practitioners from the many fields involved. Electronic routes for monitoring current and future progress are also provided. This book is available for purchase from Springer for US$154.

LAST UPDATE: 2/10/2007

SOURCE: Plumbridge, W.J., Matela, R.J., Westwater, A.. Structural Integrity and Reliability in ElectronicsEnhancing Performance in a Lead-Free Environment. New York: Springer, 2004.

LINK: Structural Integrity and Reliability in Electronics: Enhancing Performance in a Lead-Free Environment