This book provides an overview of the principles of soldering technology in the beginning with the theory underlying each concept. Focusing on the most up-to-date methods for testing and characterization, these theories are then reinforced by experimental examples and industrial applications. Topics include: packaging architecture and assembly technology; wetting and joint formation; microstructural instability in solders; intermetallic formation and growth; mechanical properties and creep behaviour; thermomechanical fatigue; product assurance. The purchase price is US$129 from Springer.

LAST UPDATE: 2/10/2007

SOURCE: Evans, John W.. A Guide to Lead-free Solders:Physical Metallurgy and Reliability. New York: Springer, 2007.

LINK: A Guide to Lead-free Solders: Physical Metallurgy and Reliability