This suite of resources covers thermomechanical fatigue of lead-free solders. It offers in-depth coverage of the fundamentals of thermomechanical fatigue and recent progress in the understanding of the metallurgy/fatigue of lead-free solders.

Clicking on the attachment at the end of this entry provides access to downloadable versions of the following key TMS resources and useful links:

•Frear, D.R. “Thermomechanical Fatigue in Solder Materials,” Solder Mechanics – State of the Art Assessment.
•Subramanian, K.N., et. al. “Thermomechanical Fatigue and Fracture of Sn-based Solders.”
•Telang, A.U., et. al. “The Orientation Imaging Microscopy of Lead-Free Sn-Ag Solder Joints.”
•“Fatigue Life Correlations,” National Institute of Standards,
•Siewart, T.A., et. al. “Test Procedures for Developing Solder Data.”
•Zubelewicz, A. “Experiments Needed to Characterize Solder Joint Behavior.”

Citation: "Thermomechanical Fatigue of Solders." Materials Technology@TMS. 2007. TMS.