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"Electronic Packaging Activities at the Rensselaer Polytechnic
Institute's Center for Integrated Electronics" (Forum Lab Report),
D.B. Knorr, July 1992, pp. 54-55.
"Electronic Packaging Research and Education at Cornell University" (Forum Lab Report), C-Y. Li, June 1991, pp. 48-49. "Investigating the Integrity and Reliability of Electronic Packaging and Interconnection Materials" (Forum Lab Report), B. Sandor and T. Kilinski, September 1990, p. 55. "The Institute of Materials Processing at Michigan Technological University" (Forum Lab Report), K.L. Paxton II and C.J. Kloecker, July 1990, p. 47. "The Microelectronics Packaging Program at Lehigh University" (Forum Lab Report), R.J. Jaccodine, June 1991, pp. 49-50. "Researching Metal-Matrix Composites at MIT's Department of Materials Science and Engineering" (Forum Lab Report), A. Mortensen, V.J. Michaud, and M.C. Flemings, January 1993, pp. 62-63. "Unit Process Modeling Developments at the Edison Materials Technology Center" (Forum Lab Report), L.L. Midolo and E.F. Moore, October 1991, pp. 55-57. "The University of Delaware's Center for Composite Materials" (Forum Lab Report), R.L. McCullough and D.S. Kukich, August 1993, pp. 70-72. "Using Federal X-Ray, Electron, and Neutron Facilities" (Forum Lab Report), S. Spooner, October 1992, pp. 72-76. (Correction printed in November 1992, p. 67.)
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