"Advances in Composite Materials for Thermal Management in Electronic Packaging" (Overview), C. Zweben, June 1998, pp. 47-51.

"Advances in High-k Dielectric Gate Materials for Future ULSI Devices" (Overview), Rajnish K. Sharma, Ashok Kumar, and John M. Anthony, June 2001, pp. 53-55.

"Advances in Lithium-Ion Battery Research and Technology" (Commentary), Daniel Abraham, March 2002, pp. 18-19.

"Advances in Microelectronic Processing" (Commentary), N.M. Ravindra and A. Kumar, June 2001, p. 42.

"Advances in Thermal Management Materials for Electronic Applications" (Commentary), S. Jin, June 1998, p. 46.

"Ag₃Sn Plate Formation in the Solidification of Near-Ternary Eutectic Sn-Ag-Cu" (Research Summary), Sung K. Kang, Won Kyoung Choi, Da-Yuan Shih, Donald W. Henderson, Timothy Gosselin, Amit Sarkhel, Charles Goldsmith, and Karl J. Puttlitz, June 2003, pp. 61-65.

"Aluminum Composite Materials for Multichip Modules" (Overview), M.K. Premkumar, W.H. Hunt, Jr., and R.R. Sawtell, July 1992, pp. 24-28.

"Analyzing Semiconductor Devices Using Modulation Spectroscopy" (Overview), F.H. Pollak, H. Qiang, D. Yan, Y. Yin, and W. Krystek, September 1994, pp. 55-59.

"Aspects of Structural Evolution of Lead-Free Solder Joints" (Research Summary), A. Zribi, R. Kinyanjui, P. Borgensen, L. Zavalij, and E.J. Cotts, June 2002, pp. 38-40.

"Atomic-Layer Epitaxy for Heterostructures" (Research Summary), S.M. Bedair, February 1993, pp. 46-50.

"Biosensors Based on Piezoelectric Crystal Detector: Theory and Application" (Overview), A. Kumar, October 2000.

"Carbon-Nanotube-Based Electrochemical Double-Layer Capacitor Technologies for Spaceflight Applications" (Research Summary), S. Arepalli, H. Fireman, C. Huffman, P. Moloney, P. Nikolaev, L. Yowell, C.D. Higgins, K. Kim, P.A. Kohl, S.P. Turano, and W.J. Ready, December 2005, pp. 26-31.

"Carbon Nanotube Electron Source Technology" (Overview), K.B.K. Teo, March 2007, pp. 29-32.

"The Cathodic Electrodeposition of Manganese Oxide Films for Electrochemical Supercapacitors" (Overview), I. Zhitomirsky, M. Cheong, and J. Wei, July 2007, pp. 66-69.

"The Challenge of Precursor Compounds in the MOCVD of Oxides" (JOM-e: Overview), R. Xu, October 1997.

"The Characterization of Complex Heterostructure Materials" (Commentary), J.M. Parsey, Jr., September 1994, p. 49.

"Characterizing and Etching Blue-Light Emitting Semiconductor Materials" (Commentary), J.M. Parsey, Jr., and M.S. Goorsky, August 1996, p. 45.

"Characterizing and Fabricating Materials for Blue Emission" (Commentary), J.M. Parsey, September 1997, pp. 17, 83.

"Characterizing and Monitoring Thin-Film Processes with Spectroscopic Ellipsometry" (Overview), A.R. Srivatsa and C.L. Ygartua, March 1999, pp. 34-36.

"Characterizing Nanostructured Magnetic Materials with Photonic Probes" (JOM-e: Overview), D.J. Keavney and C.M. Falco, June 2000.

"Characterizing the Temperature Dependence of Electronic Packaging-Material Properties" (Testing & Analysis), C.-Y. Fu and C. Ume, June 1995, pp. 31-35.

"Characterizing III-V Heteroepitaxial Structures" (Overview), R.S. Rai and C.A. Parsons, September 1994, pp. 50-54.

"Chemical-Mechanical Planarization of Cu and Ta" (Overview), S.V. Babu, Y. Li, and A. Jindal, June 2001, pp. 50-52.

"The Chemical Modeling of Electronic Materials and Interconnections" (Overview), J.K. Kivilahti, December 2002, pp. 52-57.

"Chemical Vapor Deposited Diamond for Thermal Management" (Overview), J.E. Graebner and S. Jin, June 1998, pp. 52-55.

"Composition and Heat-Treatment Effects on the Adhesion Strength of Sn-Zn-Al Solders on Cu Substrate" (Research Summary), S.-P. Yu, H.-C. Wang, M.-H. Hon, and M.-C. Wang, June 2000, pp. 36-39.

"The Compression Stress-Strain Behavior of Sn-Ag-Cu Solder" (Research Summary), Paul T. Vianco, Jerome A. Rejent, and Joseph J. Martin, June 2003, pp. 50-55.

"Controlled Placement of Nanoscale Building Blocks: Toward Large-Scale Fabrication of Nanoscale Devices" (Overview), S.J. Koh, March 2007, pp. 22-28.

"Controlling Ag₃Sn Plate Formation in Near-TYernary-Eutectic Sn-Ag-Cu Solder by Minor Zn Alloying" (Research Summary), S.K. Kang, D.-Y. Shih, D. Leonard, D.W. Henderson, T. Gosselin, S.-I. Cho, H. Yu, and W.K. Choi, June 2004, pp. 34-38.

"Converting to Lead-Free Solders: An Automotive Industry Perspective" (Overview), W.L. Winterbottom, July 1993, pp. 20-24.

"Copper Interconnects for Semiconductor Devices" (Overview), Sailesh M. Merchant, Seung H. Kang, Mahesh Sanganeria, Bart van Schravendijk, and Tom Mountsier, June 2001, pp. 43-48.

"Copper/Low-k Interconnects for Smaller and Faster Circuits" (Overview), H. Mavoori, September 1999, p. 36.

"The Correlation between the Electronic Structure and Elastic Properties of Nanolaminates" (Overview), D. Music and J.M. Schneider, July 2007, pp. 60-64.

"Cost-Effective, High-Volume Molecular Beam Epitaxy" (Overview), D. Hartzell, L.K. Leung, and F.J. Towner, August 1998, pp. 37-39.

"Creep Deformation Behavior of Sn-3.5Ag Solder at Small Length Scales" (Research Summary), M. Kerr and N. Chawla, June 2004, pp. 50-54.

"The Creep Properties of Lead-Free Solder Joints" (Research Summary), H.G. Song, J.W. Morris, Jr., and F. Hua, June 2002, pp. 30-32.

"The Creep Properties of Precipitation-Strengthened Tin-Based Alloys" (Research Summary), R.J. McCabe and M.E. Fine, June 2000, pp. 33-35.

"Creep Properties of Sn-Ag Solder Joints Containing Intermetallic Particles" (Research Summary), S. Choi, J.G. Lee, F. Guo, T.R. Bieler, K.N. Subramanian, and J.P. Lucas, June 2001, pp. 22-26.

"Current Developments in Electronic Packaging Materials" (Commentary), J. Glazer, June 1991, p. 7.

"The Current Status of Commercial Low-Temperature Silicon Epitaxy" (Overview), J.O. Borland, October 1991, pp. 23-27.

"Damage Integral Analysis of Solder Joint Fatigue" (Design), J. McGroarty, R. Subrahmanyan, and C-Y. Li, June 1991, pp. 16-20.

"Defects and Interfaces in Electronic Materials" (Commentary), D.C. Paine, March 1994, p. 46.

"Designers Make Their Mark with Computer Chips" (Feature), Maureen Byko, June 2001, pp. 12-13.

"Designing Low-Thermal-Expansivity, High-Conductivity Alloys in the Cu-Fe-Ni Ternary System" (Overview), R.D. Cottle, X. Chen, R.K. Jain, Z. Eliezer, L. Rabenberg, and M.E. Fine, June 1998, pp. 67-69.

"Developing Lead-Free Solders: A Challenge and Opportunity" (Commentary), S. Jin, July 1993, p. 13.

"Developing Melt-Textured YBCO" (Overview), T. Habisreuther, M. Zeisberger, D. Litzkendorf, O. Surzhenko, and W. Gawalek, June 2000, pp. 26-28.

"Developing Nitride-Based Blue LEDs on SiC Substrates" (Research Summary), J. Edmond and J. Lagaly, September 1997, pp. 24-26.

"The Development of the COST 531 Lead-Free Solders Thermodynamic Database" (Overview), A. Kroupa, A.T. Dinsdale, A. Watson, J. Vrestal, J. Vizdal, and A. Zemanova, July 2007, pp. 20-25.

"The Development of Nanocrystalline Silicon for Emerging Microelectronic and Nanoelectronic Applications" (Overview), C.C. Striemer, R. Krishnan, and P.M. Fauchet, October 2004, pp. 20-25.

"Developments in Lead-Free Solders and Soldering Technology" (Commentary), Sung K. Kang, June 2002, p. 25.

"Diffusion Soldering for Stable High-Temperature Thin-Film Bonds" (Overview), T. Studnitzky and R. Schmid-Fetzer, December 2002, pp. 58-63.

"Dimensionally Stable Solders for Optoelectronics and Microelectronics" (Commentary), H. Mavoori, June 2000, p. 29.

"Dislocations in Strained Layers: The Ge-Si System" (Overview), E.P. Kvam and S.B. Samavedam, March 1994, pp. 47-51.

"Dispersion Strengthening for Dimensionally Stability in Low-Melting-Point Solders" (Research Summary), H. Mavoori and S. Jin, June 2000, pp. 30-32.

"The Drive for Further Miniaturization: Silicon Nanoelectronics" (Commentary), N.M. Ravindra, June 2005, pp. 14-15.

"The Dry Etching of Group III-Nitride Wide-Bandgap Semiconductors" (Overview), H.P. Gillis, D.A. Choutov, and K.P. Martin, August 1996, pp. 50-55.

"The Effect of Pretinning on the Solderability of Copper" (Research Summary), A.J. Sunwoo, H. Hayashigatani, J.W. Morris, Jr., and G.K. Lucey, Jr., June 1991, pp. 21-24.

"The Effect of Reflow Process Variables on the Wettability of Lead-Free Solders" (Research Summary), C. Melton, July 1993, pp. 33-35.

"The Effects of Additives to SnAgCu Alloys on Microstructure and Drop Impact Reliability of Solder Joints" (Research Summary), W. Liu and N.-C. Lee, July 2007, pp. 26-31.

"The Effects of Cooling Rates on Microstructure and Mechanical Behavior of Sn-3.5Ag Solder" (Research Summary), F. Ochoa, J.J. Williams, and N. Chawla, June 2003, pp. 56-60.

"Electrical Applications for Novel Carbon Nanotube Morphologies: Does Function Follow Shape?" (Overview), P.R. Bandaru and A. Rao, March 2007, pp. 33-38.

"Electrically Active Polymers and Their Application" (Overview), M.E. Galvin, March 1997, pp. 52-55.

"The Electrochemical Recycling of Printed-Wiring-Board Etchants" (Research Summary), P. Adaikkalam, G.N. Srinivasan, and K.V. Venkateswaran, June 2002, pp. 48-50.

"Electrical Measurement of a Lead-Free Solder Assembly after Environmental Tests by SEM Internal Probing" (Research Summary), T.I. Shih, Y.C. Lin, J.G. Duh, T. Hsu, and W.S. Wu, July 2007, pp. 32-34.

"Electrode Materials for Rechargeable Lithium Batteries" (Overview), A. Manthiram, March 1997, pp. 43-46.

"Electromigration Effects upon Interfacial Reactions" (Overview), S.-W. Chen and C.-M. Chen, February 2003, pp. 62-67.

"Electromigration Failure of Circuit-Level Interconnections" (Overview), J.E. Sanchez, Jr., J.W. Morris, Jr. and J.R. Lloyd, September 1990, pp. 41-45.

"Electromigration in Solder Joints and Solder Lines" (Research Summary), H. Gan, W.J. Choi, G. Xu, and K.N. Tu, June 2002, pp. 34-37.

"Electronic Packaging Activities at the Rensselaer Polytechnic Institute's Center for Integrated Electronics" (Forum Lab Report), D.B. Knorr, July 1992, pp. 54-55.

"Electronic Packaging Research and Education at Cornell University" (Forum Lab Report), C-Y. Li, June 1991, pp. 48-49.

"Embedded NDE with Piezoelectric Wafer-Active Sensors in Aerospace Applications" (JOM-e: Overview), V. Giurgiutiu, January 2003.

"Emerging Technologies and Applications for Polymers" (Featured Overview), N.P. Cheremisinoff, January 1990, pp. 10-16.

"Epitaxial Thin Films of Isotropic Conductive Oxides for Devices" (Overview), C.B. Eom, March 1997, pp. 47-50.

"Epitaxy: The Key to High-Performance Semiconductor Devices" (Commentary), J.M. Parsey, Jr., December 1995, p. 24.

"Events and Trends in Metal and Minerals Commodities" (Overview), T.M. Beazley, April 1998, pp. 39-42.

"The Evolution of Technology for Electronic Materials over the Last 50 Years" (Overview), R.S. Williams, February 2007, pp. 58-59, 62.

"Experiments for First-Year Engineering Students Using Tin-Bismuth Alloys" (Feature), Mark A. Palmer, Kurt Wainwright, Lung C. Fok, and Benjamin Jones, June 2002, pp. 41-44.

"Experts Consider the Future of Electronic Materials" (Forum Roundtable), March 1995, pp. 64-65.

"Field-Induced Conductivity Changes in CMR Manganites" (Research Summary), S. Jin, March 1997, pp. 61-63.

"Flash-Assist RTP for Ultra-Shallow Junctions" (Overview), D.M. Camm, J.C. Gelpey, T. Thrum, G.C. Stuart, and S. McCoy, June 2006, pp. 32-34.

"From Research to Manufacture—The Evolution of MOCVD" (Overview), P. Grodzinski, S.P. DenBaars, and H.C. Lee, December 1995, pp,. 25-31.

"Future Manufacturing Techniques for Stacked MCM Interconnections" (Overview), R.F. Carson, P.K. Seigal, D.C. Craft, and M.L. Lovejoy, June 1994, pp. 51-55.

"Global Perspectives on Electronic Materials: Challenges and Opportunities" (Industrial Insight), W.H. Hunt, Jr., June 2004, pp. 17-21.

"Growth of η Phase Scallops and Whiskers" (Overview), Robert A. Gagliano and Morris E. Fine, June 2001, pp. 33-38.

"Growing GaN by Plasma-Assisted Molecular-Beam Epitaxy" (Research Summary), R. Beresford, March 1994, pp. 54-58. (Correction printed in June 1994, p. 63.)

"High-Density Plasma-Arc Heating Studies of FePt Thin Films" (Research Summary), A. Cole, G.B. Thompson, J.W. Harrell, J. Weston, and R. Ott, June 2006, pp. 39-42.

"High Temperature Lead-free Solder for Microelectronics" (Overview), Frank R. Gayle, Gary Becka, Jerry Badgett, Gordon Whitten, Tsung-Yu Pan, Angela Grusd, Brian Bauer, Rick Lathrop, Jim Slattery, Iver Anderson, Jim Foley, Alan Gickler, Duane Napp, John Mather, and Chris Olson, June 2001, pp. 17-21.

"The High-Volume Production of Heterojunction Bipolar Transistors" (Research Summary), N. Pan, D. Hill, C. Rose, D. McCullough, P. Rice, D.P. Vu, K. Hong, and C. Farley, August 1998, pp. 45-47.

"Infrared Analysis of Thin-Film Materials" (Overview), P.A. Rosenthal, J. Xu, S. Charpenay, J.E. Cosgrove, and N.M. Ravindra, October 2000.

"Interconnect Challenges for Nanoscale Electronic Circuits" (Overview), N. Srivastava and K. Banerjee, October 2004, pp. 30-31.

"Interconnection Technologies and Materials Science" (Conference Review), W.L. Winterbottom and S.K. Kang, June 1991, pp. 8-9.

"An Investigation of Phase Transformation Behavior in Sputter-Deposited PtMn Thin Films" (Research Summary), C.-X. Ji, P.F. Ladwig, R.D. Ott, Y. Yang, J.J. Yang, Y.A. Chang, E.S. Linville, J. Gao, and B.B. Pant, June 2006, pp. 50-54.

"An Issue in Thermal Management: Metallizing High Thermal Conductivity Ceramic Substrates in Microelectronics" (Featured Overview), A.D. Westwood and M.R. Notis, June 1991, pp. 10-15.

"Issues in High-Volume Compound Semiconductor Epitaxy" (Commentary), J.M. Parsey, Jr., August 1998, pp. 32-33.

"Issues in the Replacement of Lead-Bearing Solders" (Overview), P.T. Vianco and D.R. Frear, July 1993, pp. 14-18.

"ITO Thin-Film Transparent Conductors: Microstructure and Processing" (Testing & Analysis), Y. Shigesato, I. Yasui, and D.C. Paine, March 1995, pp. 47-50.

"The Root Cause of Black Pad Failure of Solder Joints with Electroless Ni/Immersion Gold Plating" (Research Summary), K. Zeng, R. Stierman, D. Abbott, and M. Murtuza, June 2006, pp. 75-70.

"Lead-Free Solders and Processing Issues in Microelectronics" (Commentary), Raymond A. Fournelle, June 2003, p. 49.

"Lead-Free Solders and Processing Issues Relevant to Microelectronics Packating" (Commentary), R.A. Fournelle, June 2004, p. 33.

"Lead-Free Solders: Reliability and Other Issues a Year after Legislation" (Commentary), S. Chada, July 2007, pp. 19.

"Low-Cost, Flexible Battery Packaging Material" (Overview), A.N. Jansen, K. Amine, A.E. Newman, D.R. Vissers, and G.L. Henriksen, March 2002, pp. 29-32, 54.

"Low Dielectric Constant Materials for Advanced Interconnects" (Overview), M. Morgen, E.T. Ryan, J.-H. Zhao, C. Hu, T. Cho, and P.S. Ho, September 1999, pp. 37-40.

"Low-Dimensional Structures and Interface Stability" (Commentary), D.C. Paine and B.W. Wessels, February 1993, p. 45.

"Low-Thermal-Expansion Copper Composites via Negative CTE Metallic Elements" (Design), H. Mavoori and S. Jin, June 1998, pp. 70-72.

"A Lower-Melting-Point Solder Alloy for Surface Mounts" (Research Summary), M.T. McCormack, Y. Degani, H.S. Chen, and W.R. Gesick, May 1996, pp. 54-56.

"The Luminescence Characteristics of GaN Heteroepitaxial Films" (Research Summary), P.A. Grudowski, A.L. Holmes, C.J. Eiting, and R.D. Dupuis, August 1996, pp. 46-49.

"The Magnetic Field-Assisted Assembly of Nanoscale Semiconductor Devices: A New Technique" (Overview), S. Shet, V.R. Mehta, A.. Fiory, M.P. Lepselter, and N.M. Ravindra, October 2004, pp. 32-34.

"JOM-e: Magnetic Materials in Electronic Applications" (Commentary), J.M. Parsey, Jr., June 2000, p. 16.

"Magnetic Tunnel Junction Materials for Electronic Applications" (JOM-e: Overview), J.M. Slaughter, E.Y. Chen, R. Whig, B.N. Engel, J. Janesky, and S. Tehrani, June 2000.

"The Markets for Electronic Ceramics in the 1990s" (Economics), T. Abraham, September 1993, p. 46.

"The Material Optimization and Reliability Characterization of an Indium-Solder Thermal Interface Material for CPU Packaging" (Research Summary), C. Deppisch, T. Fitzgerald, A. Raman, F. Hua, C. Zhang, P. Liu, and M, Miller, June 2006, pp. 67-74.

"Materials Challenges in Interconnection: Trade-Offs for Rapid Deployment" (Design), K. Frutschy, Z. Fu, D. Goyal, K. Kinsman, G. Samuelson, and R. Vogt, March 1999, pp. 19-21.

"Materials Issues for Advanced Electronic and Optoelectronic Connectors" (Conference Review), J. Crane and S. Wen, September 1990, pp. 37-39.

"Materials Issues in Area-Array Microelectronic Packaging" (Overview), D.R. Frear, March 1999, pp. 22-27.

"Materials Issues in the Multichip Module Packaging of Electronics" (Commentary), D.B. Knorr, D.R. Frear, and W.L. Winterbottom, July 1992, p. 7.

"Materials Issues in Strained Solid-Phase Epitaxial Growth of Si_1-xGe_x" (Overview), D.C. Paine, February 1993, pp. 55-60.

"Materials and Mechanics Issues of Solder Alloy Applications" (Conference Review), K. Kinsman, D.R. Frear and W.B. Jones, September 1990, pp. 34-36.

"Materials and Processing Issues in Nanostructured Semiconductor Gas Sensors" (JOM-e: Overview), F. Cosandey, October 2000.

"Materials, Processing, and Reliability Issues for PWB Assemblies" (Commentary), D.R. Frear and W.L. Winterbottom, June 1995, p. 26.

"Measuring the Mechanical Properties of Pb-Free Solder and Sn-Based Intermetallics by Nanoindentation" (Research Summary), R.R. Chromik, R.P. Vinci, S.L. Allen, and M.R. Notis, June 2003, pp. 66-69.

"Mechanical Aspects of Multichip Module Reliability" (Overview), D.B. Knorr, July 1992, pp. 29-35.

"The Mechanical Behavior of Interconnect Materials for Electronic Packaging" (Research Summary), D.R. Frear, May 1996, pp. 49-53.

"Metal Silicides: An Integral Part of Microelectronics" (Overview), L.J. Chen, September 2005, pp. 24-30.

"Metal-Matrix Composites for Electronic Packaging" (Overview), C. Zweben, July 1992, pp. 15-23. (Correction printed in November 1992, p. 67.)

"A Metallurgical Assessment of SnPbAg Solder for GaAs Power Devices" (Research Summary), J.M. Parsey, Jr., S. Valocchi, W. Cronin, J. Mohr, B.L. Scrivner, and K. Kyler, March 1999, pp. 28-31.

"The Metallurgical Control of Electromigration Failure in Narrow Conducting Lines" (Overview), J.W. Morris, Jr., C.-U. Kim, and S.H. Kang, May 1996, pp. 43-46.

"Metallurgical Issues in Microelectronics" (Commentary), J.M. Parsey, Jr., March 1999, p. 14.

"Metallurgical Techniques for More Reliable Integrated Circuits" (Overview), S.H. Kang, J.W. Morris, Jr., and A.S. Oates, March 1999, pp. 16-18.

"Microalloyed Aluminum for Cryogenic Conductors" (Research Summary), L.C. McDonald, K.T. Hartwig, and A. Takahashi, February 1995, pp. 41-43.

"The Microelectronics Packaging Program at Lehigh University" (Forum Lab Report), R.J. Jaccodine, June 1991, pp. 49-50.

"The Microstructural Characterization of Sensors Based on Electronic Ceramic Materials" (JOM-e: Overview), P.I. Gouma, S.A. Akbar, and M.J. Mills, November 1998.

"Microstructure and Mechanical Properties of Sn-In and Sn-Bi Solders" (Overview), J.W. Morris, Jr., J.L. Freer Goldstein, and Z. Mei, July 1993, pp. 25-27.

"The Modeling of Interfaces: Atoms or Continua?" (Tutorial), R. Phillips, March 1995, pp. 37-42, 74-75.

"Modeling Multilayered MEMS-Based Micro-Fluidic Systems" (Research Summary), S. Bhansali, H. Benjamin, V. Upadhyay, H.T. Henderson, and C.H. Ahn, March 2004, pp. 57-61.

"Molecular-Beam Epitaxy and Related Growth Techniques" (Overview), C.W. Tu, December 1995, pp. 34-37.

"Molybdenum Applications in the Electronics Market" (Overview), J.A. Shileds, Jr. and P. Lipetzky, March 2000, pp. 37-39.

"The Multichip Module as a Board-Level Package" (Overview), D.B. Knorr, June 1995, pp. 27-30.

"Multifunctional Material Systems: The First Generation" (Research Summary), L. Christodoulou and J.D. Venebles, December 2003, pp. 39-45.

"Nanocrystalline SnO Gas Sensors in View of Surface Reactions and Modifications" (Research Summary), S. Seal and S. Shukla, September 2002, pp. 35-38, 60.

"Nanolayer Coatings for Hard Disk and Demanding Tribological Applications" (Research Summary), K.W. Lee, D.-J. Li, and Y.-W. Chung, September 2002, pp. 49-52.

"Nanomaterials for Electronic Applications: Beyond Building Blocks" (Commentary), S.H. Kang, March 2007, pp. 21.

"Nanomaterials in Nanoelectronics: Who's Who and What's Next" (Economics), M.N. Rittner, June 2004, pp. 22-26.

"Nanomaterials and Their Application to Defense and Homeland Security" (Overview), J.G. Reynolds and B.R. Hart, January 2004, pp. 36-39.

"Nanoscale Engineering of Metal/Semiconductor Interfaces" (Overview), T.D. Sands, February 1993, pp. 61-64.

"A New Reduced-Oxide Soldering Activation Method" (Research Summary), D.M. Tench, D.P. Anderson, P. Jambazian, P. Kim, J. White, D. Hillman, G.K. Lucey, T. Gher, and B. Piekarski, June 1995, pp. 36-41.

"Nondestructive Characterization of Semiconductor Multilayers" (Overview), C. Pickering, September 1994, pp. 60-64.

"Nondestructive Evaluation Techniques in Semiconductor Wafer Fabrication" (Commentary), A.R. Srivatsa, March 1999, p. 33.

"Novel Materials for Electronic Packaging and Thermal Management" (Conference Review), W.H. Hunt, Jr., and M.K. Premkumar, July 1992, pp. 8-9.

"Novel Rare-Earth-Containing Lead-Free Solders with Enhanced Ductility" (Research Summary), M.A. Dudek, R.S. Sidhu, and N. Chawla, June 2006, pp. 57-62.

"The Observation and Simulaiton of Sn-Ag-Cu Solder Solidification in Chip-Scale Packaging" (Research Summary), K.-S.Kim, K. Suganuma, J.-M. Kim, and C.-W. Hwang, June 2004, pp. 39-43.

"Observations of Nucleation Catalysis Effects during Solidification of SnAgCuX Solder Joints" (Research Summary), I.E. Anderson, J. Walleser, and J.L. Harringa, July 2007, pp. 38-43.

"Optoelectronic Interconnections and Packaging: A Materials Challenge" (Commentary), D. Frear, June 1994, p. 40.

"The Orientation Imaging Microscopy of Lead-Free Sn-Ag Solder Joints" (Research Summary), A.U. Telang and T.R. Bieler, June 2005, pp. 44-49.

"The Oxidation of Lead-Free Sn Alloys by Electrochemical Reduction Analysis" (Research Summary), S. Cho, J. Yu, S.K. Kang, and D.-Y. Shih, June 2005, pp. 50-52.

"Packaging for Optoelectronic Interconnections" (Overview), R.A. Boudreau, June pp. 41-45.

"The Past, Present, and Future of DARPA's Investment Strategy in Smart Materials" (Overview), S.G. Wax, G.M. Fischer, and R.R. Sands, December 2003, pp. 17-23.

"The Past, Present, and Future of Multilayer Ceramic Multichip Modules in Electronic Packaging" (Featured Overview), A.H. Kumar and R.R. Tummala, July 1992, pp. 10-14.

"Personification: The Materials Science and Engineering of Humanoid Robots" (Materials World), M. Byko, November 2003, pp. 14-19.

"Phase Diagrams for Lead-Free Solder Alloys" (Overview), U.R. Kattner, December 2002, pp. 45-51.

"Phase Diagrams of Important Electronic Materials" (Commentary), C.R. Kao, December 2002, p. 44.

"Phase Transformation and Microstructural Evolution in Solder Joints" (Overview), S.-W. Chen, C.-H. Wang, S.-K. Lin, C.-N. Chiu, and C.-C. Chen, January 2007, pp. 39-43.

"Physical Metallurgy in Lead-Free Electronic Solder Development" (Overview), K.N. Subramanian and J.G. Lee, May 2003, pp. 26-32.

"The Plasma Etching of Electronic Materials" (Overview), T.D. Mantei, March 1994, pp. 36-39.

"The Powder-in-Tube Processing and Properties of Bi-2223" (Research Summary), U. Balachandran, A.N. Iyer, P. Haldar, and L.R. Motowidlo, September 1993, pp. 54-57.

"Predictive Thermal and Mechanical Modeling of a Developmental MCM" (Overview), R. Darveaux, K.L. Murty, and I. Turlik, July 1992, pp. 36-41.

"Processing to Obtain High-Purity Gallium" (Overview), R.G. Bautista, March 2003, pp. 23-26.

"The Production and Electrical Characterization of Free-Standing Cubic Single-Crystal Si Nanoparticles" (Overview), S.A. Campbell, U. Kortshagen, A. Bapat, Y. Dong, S. Hilchie, and Z. Shen, October 2004, pp. 26-29.

"Production-Scale Molecular Beam Epitaxy for High-Frequency Applications" (Overview), F.J. Bruni and L.T. Nuyen, August 1998, pp. 34-36.

"Progress in the Design of New Lead-Free Solder Alloys" (Overview), M. McCormack and S. Jin, July 1993, pp. 36-40.

"Progress in the Low-Temperature Epitaxy of Silicon and Silicon-Based Heterostructures" (Commentary), M.L. Green, October 1991, p. 22.

"Properties of High-Tc Wires Made by the Metallic Precursor Process" (Overview), A. Otto, C. Craven, D. Daly, E.R. Podtburg, J. Schreiber, and L.J. Masur, September 1993, pp. 48-52.

"The Properties of Melt-Textured Superconductors" (Overview), M. Murakami, June 2000, pp. 22-24.

"The Properties of Tin-Bismuth Alloy Solders" (Overview), L.E. Felton, C.H. Raeder, and D.B. Knorr, July 1993, pp. 28-32.

"Public Health and Environmental Benefits of Adopting Lead-Free Solders" (Overview), O.A. Ogunseitan, July 2007, pp. 12-17.

"Pulse-Thermal Processing for Electroinc Applications" (Commentary), R. Ott, June 2006, p. 31.

"Pulse-Thermal Processing of Chemically Synthesized FePt Nanoparticles"(Research Summary), S. Shi, S. Kang, J. Lawson, Z. Jia, D. Nikles, J.W. Harrell, R. Ott, and P. Kadolkar, June 2006, pp. 43-45.

"The Pulse Thermal Processing of Nanocrystalline Silicon Thin-Films" (Research Summary), R.D. Ott, P. Kadolkar, C.A. Blue, and G.B. Thompson, October 2004, pp. 45-47.

"The Pulse-Thermal Processing of NdFeB-Based Nanocomposite Magnets" (Research Summary), Z.Q. Jin, V.M. Chakka, Z.L. Wang, J.P. Liu, P. Kadolkar, and R.D. Ott, June 2006, pp. 46-49.

"A Quality-Based Cost Model for New Electronic Systems and Products" (Overview), S.G. Shina and A. Saigal, April 1998, pp. 29-33.

"The Rapid Thermal Processing Chemical Vapor Deposition of Silicon Epitaxial Films" (Overview), K.H. Jung, T.Y. Hsieh, and D.L. Kwong, October 1991, pp. 38-43.

"Rapid Thermal Processing for Silicon Nanoelectronics Applications" (Overview), A.T. Fiory, June 2005, pp. 21-26.

"Raycing with the Sun: Solar Cars Thrive in Summer Heat" (Feature), K. Roncone, July 2002, pp. 14-17.

"Recent Advances in Electrically Conductive Materials" (Commentary), S. Jin, March 1997, p. 37.

"Recent Developments in Anode Materials for Lithium Batteries" (Overview), M.M. Thackeray, J.T. Baughey, and L.M.L. Fransson, March 2002, pp. 20-23.

"Recent Developments in Applying Smart Structural Materials" (Commentary), C.U. Hardwicke, December 2003, pp. 15-16.

"Recent Developments in Melt-Textured Superconductors" (Commentary), K. Salama, June 2000, p. 17.

"Recent Progress in Large-Grain REBCO Melt Texturing" (Overview), W. Lo, June 2000, pp. 18-21.

"Recent Progress in Pb-Free Solders and Soldering Technologies" (Commentary), Sung K. Kang, June 2001, p. 16.

"Recent Progress in Silicon Molecular-Beam Epitaxy" (Overview), H.-J. Gossmann and D.J. Eaglesham, October 1991, pp. 28-31.

"Rechargeable Lithium-Ion Battery Cathodes: In-Situ XAS" (Research Summary), J. McBreen and M. Balasubramanian, March 2002, pp. 25-28.

"The Root Cause of Black Pad Failure of Solder Joints with Electroless Ni/Immersion Gold Plating" (Research Summary), K. Zeng, R. Stierman, D. Abbott, and M. Murtuza, June 2006, pp. 75-70.

"RTCVD Growth and Applications of Epitaxial Si_1-xGe_x Alloys" (Overview), J.C. Sturm, October 1991, pp. 44-47.

"Self-Repairing Joints Employing Shape-Memory Alloy Actuators" (Overview), G. Park, D.E. Muntges, and D.J. Inman, December 2003, pp. 33-37.

"Silicon Nanoelectronics: Precise Fabrication via a Bottom-Up Approach" (Commentary), S.H. Kang, October 2004, p. 19.

"Silicon Nanoelectronics and Beyond: An Overview and Recent Developments" (Overview), N.M. Ravindra, V.R. Mehta, and S. Shet, June 2005, pp. 16-20.

"Silicon Solar Cells: Physical Metallurgy Principles" (Overview), Michael G. Mauk, May 2003, pp. 38-42.

"Sintered Aluminum Nitride Ceramics for High-Power Electronic Applications" (Overview), J.H. Harris, June 1998, pp. 56-60.

"Sn-Ag-Cu and Sn-Cu Solders: Interfacial Reactions with Platnimum" (Research Summary), T.H. Kim and Y.-H. Kim, June 2004, pp. 45-49.

"Sn-Ag-Cu Solders and Solder Joints: Alloy Development, Microstructure, and Properties" (Research Summary), I.E. Anderson, B.A. Cook, J.L. Harringa, and R.L. Terpstra, June 2002, pp. 26-29.

"Soft Magnetic Materials: Nanocrystalline Alloys from Amorphous Precursors" (Overview), Matthew A. Willard and Vincent G. Harris, March 2002, pp. 44-46.

"Solder Engineering for Optoelectronic Packaging" (Overview), Y.C. Lee and N. Basavanhally, June 1994, pp. 46-50.

"Solidification Shrinkage Defects in Electronic Solders" (Overview), G. S. Wable, S.s Chada, B. Neal, and R.A. Fournelle, June 2005, pp. 38-42.

"Solid-Liquid Reactions: The Effect of Cu Content on Sn-Ag-Cu Interconnect" (Research Summary), H.Y. Lu, H. Balkan, and S. Ng, June 2005, pp. 30-35.

"The Status of Conductive Polymers" (Economics), P.J. Mooney, March 1994, pp. 44-45.

"The Status of Two-Dimensional Si/SiGe Heterostructures" (Overview), S.F. Nelson, February 1993, pp. 51-54.

"Studying Orientation Relationships in Heteroepitaxial Systems" (Research Summary), S. Dakshinamurthy and K. Rajan, March 1994, pp. 52, 53.

"The Surprising Superconductor: MbB₂" (Conference Review), George Crabtree, June 2001, p. 14.

"A Synchrotron Radiation X-Ray Microdiffraction Study on Orientation Relationships between a Cu₆Sn₅ and Cu Substrate in Solder Joints" (Research Summary), J.L. Suh, K.N. Tu, and N. Tamura, June 2006, pp. 63-66.

"The Systems-Based Design of High-Strength, High-Conductivity Alloys" (Overview), G. Ghosh, J. Miyake, and M.E. Fine, March 1997, pp. 56-60.

"Ten Years (and One Week) in Superconductivity" (Review and Preview), M.C. Munson, September 1993, p. 47.

"The Thermal Conductivity of Metallic Ceramics" (Overview), W.S. Williams, June 1998, pp. 62-66.

"The Thermodynamics and Kinetics of Film Agglomeration" (Tutorial), D.J. Srolovitz and M.G. Goldiner, March 1995, pp. 31-36, 76, 77.

"Thin-Film Shape-Memory Materials for High-Temperature Applications" (Overview), D.S. Grummon, December 2003, pp. 24-32.

"Thin Films and Interfaces: Modeling and Characterization" (Commentary), D.C. Paine, March 1995, p. 30.

"Thin Films, Thick Films and Multichip Modules" (Economics), J.A. Castrovilla, June 1991, p. 25.

"III-V Nitride Semiconductors for High-Performance Blue and Green Light-Emitting Devices" (Overview), D. Steigerwald, S. Rudaz, H. Liu, R.S. Kern, W. Götz, and R. Fletcher, September 1997, pp. 18-23

"Tin Pest in Sn-0.5wt.% Cu Lead-free Solder" (Research Summary), Yoshiharu Kariya, Naomi Williams, Colin Gagg, and William Plumbridge, June 2001, pp. 39-41.

"Transition Metal Carbides, Nitrides, and Borides for Electronic Applications" (Overview), W.S. Williams, March 1997, pp. 38-42.

"Ultrahigh-Vacuum CVD Epitaxy of Silicon and Ge_xSi_1-x" (Overview), M. Racanelli and D.W. Greve, October 1991, pp. 32-37.

"Using CD-SEM Metrology in the Manufacture of Semiconductors" (Overview), J. McIntosh, March 1999, pp. 38-39.

"Using Mechanical Processing in Recycling Printed Wiring Boards" Research Summary), Hugo M. Veit, Carolina de C. Pereira, and Andréa M. Bernardes, June 2002, pp. 45-47.

"Vertically Oriented Single-Wall Carbon Nanotube/Enzyme on Silicon as Biosensor Electrode" (Research Summary), Y. Wang and Z. Iqbal, June 2005, pp. 27-29.

"The Volume Production of GaAs and Related Compounds by MOVPE" (Overview), M. Hata, August 1998, pp. 40-43.

"The X-Ray Characterization of InGaN and AlGaN Heterostructures for Blue-Light Emitters" (Research Summary), C.J. Eiting, P.A. Grudowski, and R.D. Dupuis, September 1997, pp. 27-30.

"Y-Junction Single-Wall Carbon Nanotube Electronics" (Research Summary), W. Choi, D.-H. Kim, Y.C. Choi, and J. Huang, March 2007, pp. 44-49.