JOURNAL OF ELECTRONIC MATERIALS
	TABLE OF CONTENTS Volume 26, Number 8, August 1997 This Month Featuring: Regular Issue Papers and Letters. View August 1997 Abstracts.

REGULAR ISSUE PAPERS

Low Resistance Contacts to p-CuInSe₂ and p-CdTe Crystals [pp. 893-897]
M.K. Rabinal, I. Lyubomirsky, E. Pekarskaya, V. Lyakhovitskaya, and David Cahen

Growth of Thick GaN Films on RF Sputtered AlN Buffer Layer by Hydride Vapor Phase Epitaxy [pp. 898-902]
Heon Lee, Masaaki Yuri, Tetsuzo Ueda, James S. Harris, and Kyusik Sin

The Metalorganic Chemical Vapor Deposition Growth of AlAsSb and InAsSb/InAs Using Novel Source Materials for Infrared Emitters [pp. 903-909]
R.M. Biefeld, S.R. Kurtz, and A.A. Allerman

Rectifying Characteristics of Heterostructures with Diamond and Diamond-Like Carbon Films [pp. 910-914]
Ming-Rong Shen, Hao Wang, Zhao-Yuan Ning, Chao Ye, Zhao-Qiang Gan, and Zhao-Xing Ren

Cryogenic Thermoelectric Cooler with a Passive Branch [pp. 915-921]
C. Cipagauta Mino, J.W. Cochrane, E.H. Volckmann, and G.J. Russell

Type I and Type II Alignment of the Light Hole Band in In_0.15Ga_0.85As/GaAs and in In_0.15Ga_0.85As/Al_0.15Ga_0.85As Strained Quantum Wells [pp. 922-927]
E.M. Goldys, H.Y. Zuo, M.R. Phillips, C.M. Contessa, M.R. Vaughan, and T.L. Tansley

Nickel Filament Polymer-Matrix Composites with Low Surface Impedance and High Electromagnetic Interference Shielding Effectiveness [pp. 928-934]
Xiaoping Shui and D.D.L. Chung

Chemical-Mechanical Polishing of Parylene-N Films: Evaluation by X-Ray Photoelectron Spectroscopy and Atomic Force Microscopy [pp. 935-940]
G.-R. Yang, Y.-P. Zhao, Jan M. Neirynck, Shyam P. Murarka, and Ronald J. Gutmann

Patterning Amorphous Fluoropolymer Films by Reactive Ion Milling [pp. 941-943]
M.W. Denhoff and Mae Gao

Determination of the Band Offset of GaInP-GaAs and AlInP-GaAs Quantum Wells by Optical Spectroscopy [pp. 944-948]
H.C. Kuo, J.M. Kuo, Y.C. Wang, C.H. Lin, H. Chen, and G.E. Stillman

Deposition of High Purity Parylene-F Using Low Pressure Low Temperature Chemical Vapor Deposition [pp. 949-953]
P.K. Wu, G.-R. Yang, L. You, D. Mathur, A. Cocoziello, C.-I. Lang, J.A. Morre, T.-M. Lu, and H. Bakru

Significantly Improved Mechanical Properties of Bi-Sn Solder Alloys by Ag-Doping [pp. 954-958]
M. McCormack, H.S. Chen, G.W. Kammlott, and S. Jin

LETTERS

Copper Metallizations for Integrated Circuits: TEM Analysis and Electrical Characterization [pp. L17-L20]
P. Bruschi, C. Ciofi, V. Dattilo, A. Diligenti, A. Nannini, and B. Neri

Direct Evidence of Au Segregation in Laser Welded Au-Coated Invar Material [pp. L21-L23]
S.C. Wang, S. Chi, K.C. Hsieh, Y.D. Yang, and W.H. Cheng