TMS 2016 Course Offerings
12th Annual Lead-Free Solders and Interconnect Technology Workshop
Additive Manufacturing Materials and Processes Workshop
Avizo 3D Analysis Software for Materials Science*
Characterization of Dielectric Materials for Microwave Processing
Effects and Control of Impurities Along the Aluminum Value Chain
Energy Management in the Materials Industry
Explore CES Software Tools for Materials Related Critical Decision-Making in Industry, Research, and Education*
Managing Technical and Financial Risk in a New Technology Project Environment
Multiphysics Materials Simulations Using the Open Source MOOSE Framework
NSF Grant Proposal Writing Workshop
Practical Methods for "In-Plant" Testing of Carbon Anodes Used in Aluminum Smelting
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| Title | 12th Annual Lead-Free Solders and Interconnect Technology Workshop |
| When | Sunday, February 14, 2016, 8:30 a.m. to 4:30 p.m. (CST) |
| Where | Music City Center |
| Sponsorship | TMS Functional Materials Division (FMD) |
| Organizers | Lead Organizer: Fan Hua, Intel
Co-organizers: Fan-Yi Ouyang, National Tsing Hua University; Babak Arfaei, Universal Instrument; Albert Wu, National Central University; and Tae-Kyu Lee, Cisco
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| Workshop Length | Full day |
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97% of surveyed attendees at the TMS2015 course were satisfied or very satisfied with the overall program of this workshop.
SCOPE
The annual Lead-Free Solders and Interconnect Technology Workshop provides the latest development and research studies on interconnect materials and electronic packaging technologies. Due to the miniaturization and multi-functional trends for electronic packages, the key materials used in different levels of packaging have dramatically changed or experienced severe service conditions. 2.5D and 3D interposer related technology show a fast trend in the industry looking for more fundamental mechanisms to be explored. In addition to the 3D technology in multi-stacking packages and interconnects, new methodologies like additive manufacturing with embedded interconnects are new areas for further research and development. But still, with these introductions of new technologies researchers in these fields have agreed that fundamental studies are needed to go further in materials perspective of view in order to improve the service capability of the new materials and assemblies. The workshop will both introduce the new technology trends and will also provide and address deep-dive discussion topics for both industry and academia.
WHO ATTENDS?
Individuals working in the following areas will benefit from this workshop:
- Electronic industry, related to electronic packaging and semiconductor manufacturing
- Automobile, telecommunication, and military industries which use electronic devices
- Academia and research institutes conducting research on interconnects, thermal/mechanical reliability testing, and new material development, not only on solder or interconnect materials, but also performing research on thermal interface and structure materials are target audience
INSTRUCTORS
Instructors to be announced in late 2015.
REGISTRATION
Registration Fees*:
Before January 8, 2016
After January 8, 2016
* Registration fees include mid-morning and mid-afternoon refreshment breaks. There will be a mid-day break during which attendees can get lunch on their own.
** Must be a full-time student at an accredited university to register at the student rate. Copy of valid student school identification card must accompany registration form.
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