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General Abstracts: Electronic, Magnetic and Photonic Materials Division
Lead Organizer: Long Qing Chen, Pennsylvania State University
A collection of topics will be covered.
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General Poster Sessions
Visual presentations on electronic materials will be showcased.
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3D Packaging
Lead Organizer: Andre Lee, Michigan State University
The symposium covers materials and processes for reliable three-dimensional packaging primarily through silicon via technology.
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Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials IX
Lead Organizer: Chih-ming Chen, National Chung Hsing University
This will be the ninth in a series of TMS symposia addressing the stability, transformation and formation of phases during the fabrication, processing and utilization of electronic materials and devices.
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Coatings for Structural, Biological, and Electronic Applications
Lead Organizer: Nuggehalli M. Ravindra, New Jersey Institute of Technology
This forum will stimulate new ideas, identify critical problems, provide promising solutions and assess possible road maps leading to the solutions.
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Pb-free Solders and Emerging Interconnect and Packaging Technologies
Lead Organizer: Kwang-Lung Lin, National Cheng Kung University
This symposium will cover solder materials and technology, solder interconnects, solder materials behavior and interconnects for emerging technologies.
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