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IMPORTANT DATES
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Submission Deadline
Extended to March 16, 2004
Notification of Acceptance
April 5, 2004
Early Registration Deadline
Passed
Welcoming Reception
June 21, 2004
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The 62nd Device Research Conference (DRC) will be held at Notre Dame University, Notre Dame, Indiana from June 21 through June 23, 2004.
This conference brings together scientists, engineers, and students to discuss
new and exciting breakthroughs and advances in the field of device research.
A variety of novel device structures will be discussed, including micromachined
devices, silicon CMOS/BiCMOS, silicon scaled and ultrasmall devices, wireless/microwave
devices, wide bandgap devices, and much more.
LATE NEWS PAPERS
Late news papers will be considered. Authors must submit their abstract
by June 4, 2004, to www.deviceresearchconference.org.
REGISTRATION AND HOUSING INFORMATION
For budgeting purposes, the registration
fees are as follows:
- Full Conference Member of IEEE or TMS that register before June
10, 2004 (extended from June 2nd), is $350.
- Full Conference Non-Member that register before June 10, 2004 (extended
from June 2nd), is $400.
- Full Conference Member of IEEE or TMS that register after June 10,
2004 is $425.
- Full Conference Non-Member that register after June 10, 2004 is $475.
- Students that register before June 10, 2004 (extended from
June 2nd), is $125.
- Students that register after June 10, 2004 is $175.
Students will also receive a reduced registration fee. Limited travel
funds are available to students presenting papers. Further information
on student assistance may be obtained by writing to Pallab Bhattacharya,
General Program Chair:
Pallab Bhattacharya
University of Michigan
Department of Electrical Engineering and Computer Science
1301 Beal Avenue
Ann Arbor, MI 48109-2122
Tel: (734) 763-6678
Fax: (734) 763-9324
Email: pkb@eecs.umich.edu
EMC/DRC
The Device
Research Conference (DRC) and the Electronic
Materials Conference (EMC) of TMS
will again coordinate activities. The DRC
will be held on Monday, June 21 through Wednesday, June 23, 2004. The
EMC
will be held on Wednesday, June 23 through Friday, June 25, 2004. Device-oriented
papers should be submitted to the DRC
and materials-oriented papers to the EMC.
TECHNICAL PROGRAM
The complete technical
program for the meeting can be downloaded in portable document format
and viewed and printed using Adobe
Acrobat. Areas of coverage include, but not limited to the following:
- Amorphous & polycrystalline devices
- Carbon nanotube devices
- Devices for displays & imaging
- Device modeling
- III-V FET and bipolar transistors
- Integrated optoelectronics
- High voltage/high power devices
- Magnetic devices
- Micro/nanoelectromechanical devices
- Millimeter wave and ultrafast devices
- Molecular devices
- Nanofabrication technology for devices
- Nonvolatile, static and dynamic memory
- Optical sources and detectors
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- Organic emitters and transistors
- Plastic electronics
- Quantum-effect and single-electron devices
- Reliability
- Sensors
- SiGe, SiGeC, and SiC devices
- Silicon CMOS/BiCMOS
- Silicon scaled and nanoscale devices
- SOI and 3-D Devices
- Spin-based devices
- Superconducting devices
- Thin film transistors
- Tunneling and hot-electron devices
- Wide-bandgap devices
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PLENARY AND INVITED
SPEAKERS
Plenary and invited speakers will present
the latest developments in emerging device
technologies including scaled silicon, wide
bandgaps, carbon nanotubes, molecular electronics,
large-area electronics, bio-inspired
electronics, and spintronics.
Partial List of Invited Speakers:
- Yasuhiko Arakawa (University of Tokyo)
- Sanjay Banerjee (University of Texas, Austin)
- David Emerson (CREE, Inc.)
- Stephen Empedocles (Nanosys, Inc.)
- Mark Hersam (Northwestern University)
- Thomas Jackson (Penn State University)
- Thomas Knight (Massachusetts Institute of
Technology)
- Mark Lundstrom (Purdue University)
- Richard Martel (University of Montreal)
- Umesh Mishra (University of California,
Santa Barbara)
- Hiroo Munekata (Tokyo Institute of
Technology)
- Nongjian Tao (Arizona State University)
- Lukas Worschech (University of Wurzburg)
POSTER AND RUMP
SESSIONS
Building on the success of poster sessions
in previous years, abstracts will again be
accepted for poster presentations at DRC
2004. In the DRC tradition, rump sessions
will continue to provide a forum for frank
discussion of contentious topics in device
research and applications.
BEST STUDENT PAPER
AWARD
Papers presented by students, based on their
own research, are eligible for this annual
award. The abstract must be identified as
a “Student Paper” during the submission
process to be eligible for this award.
FOR MORE INFORMATION
TMS
Meeting Services
184 Thorn Hill Road
Warrendale, PA 15086 USA
Tel: (724) 776-9000 x243 • Fax: (724) 776-3700
Email: mtgserv@tms.org
or, complete the TMS
Upcoming Meetings Mailing List Form to receive additional informatin
about this meeting.
2004 DRC ORGANIZERS
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GENERAL PROGRAM CHAIR
Pallab Bhattacharya
University of Michigan
Department of Electrical Engineering and Computer Science
1301 Beal Avenue
Ann Arbor, MI 48109-2122
Tel: (734) 763-6678
Fax: (734) 763-9324
Email: pkb@eecs.umich.edu
TECHNICAL PROGRAM VICE CHAIR
Theresa Mayer
Penn State University
230 Electrical Engineering West
University Park, PA 16802
Phone: (814) 863-8458
Fax: (814) 865-7065
Email: tsm2@psu.edu
TREASURER
Tom Jackson, Penn State University
PAST CHAIR
Jeff Welser, IBM
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TECHNICAL PROGRAM CHAIR
Alan Seabaugh
University of Notre Dame
266 Fitzpatrick Hall
Notre Dame, IN 46556
Tel: (574) 631-4473
Fax: (574) 631-4393
Email: seabaugh.1@nd.edu
LOCAL ARRANGEMENTS CHAIR
Patrick Fay
261 Fitzpatrick Hall
Department of Electrical Engineering
University of Notre Dame, Notre Dame, IN 46556-5637
Phone: (574) 631-5693
Fax: (574) 631-4393
Email: fay.9@nd.edu
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2004 DRC TECHNICAL PROGRAM COMMITTEE
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Joerg Appenzeller
IBM T.J. Watson Research Center
Bobby Brar
Rockwell Scientific Company
Andy Bryant
IBM
Jeff Casady
Mississippi State University
Augusto Gutierrez-Aitken
Northrop Grumman Space Technology
Pranav Kalavade
Intel
Fumio Koyama
Tokyo Institute of Technology
Roger Lake
University of California, Riverside
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Lynn Loo
University of Texas
John O’Brien
University of Southern California
Alberto Salleo
Palo Alto Research Center
Nitin Samarth
Penn State University
Tetsuya Suemitsu
NTT Photonics Laboratories
Joerg Schulze
University of the German Federal Armed Forces
Lars Erik Wernersson
University of Lund
Yifeng Wu
CREE Santa Barbara Technology Center
John Zolper
DARPA/MTO
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