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The 61st Device Research Conference (DRC) will be held in Salt Lake City,
Utah from June 23 through June 25, 2003.
This conference brings together scientists, engineers, and students to discuss
new and exciting breakthroughs and advances in the field of device research.
A variety of novel device structures will be discussed, including micromachined
devices, silicon CMOS/BiCMOS, silicon scaled and ultrasmall devices, wireless/microwave
devices, wide bandgap devices, and much more.
EMC/DRC
The Device
Research Conference (DRC) and the Electronic
Materials Conference (EMC) of TMS
will again coordinate activities. The DRC
will be held on Monday, June 23 through Wednesday, June 25, 2003. The
EMC
will be held on Wednesday, June 25 through Friday, June 27, 2003. Device-oriented
papers should be submitted to the DRC
and materials-oriented papers to the EMC.
FOR MORE INFORMATION, PLEASE CONTACT:
TMS
Meeting Services
184 Thorn Hill Road
Warrendale, PA 15086 USA
Tel: (724) 776-9000 x243 Fax: (724) 776-3700
Email: mtgserv@tms.org
or, complete the TMS
Upcoming Meetings Mailing List Form to receive additional informatin
about this meeting.
2003
DRC ORGANIZERS
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GENERAL
PROGRAM CHAIR
Jeff Welser
IBM Microelectronics
West Campus - E40
2070 Route 52
Hopewell Junction, NY 12533
Tel: (845) 892-5142 • Fax: (845) 892-2568
E-mail: welser@us.ibm.com
TECHNICAL PROGRAM VICE CHAIR
Alan Seabaugh, University of Notre Dame
TREASURER
Tom Jackson, Penn State University
PAST CHAIR
Sanjay Banerjee, University of Texas |
TECHNICAL
PROGRAM CHAIR
Pallab Bhattacharya
University of Michigan
Department of Electrical Engineering
and Computer Science
1301 Beal Avenue
Ann Arbor, MI 48109-2122
Tel: (734) 763-6678 • Fax: (734) 763-9324
E-mail: pkb@eecs.umich.edu
(http:
//www.eecs.umich.edu/PKB-GROUP/)
LOCAL ARRANGEMENTS CHAIR
Mark S. Miller, University of Utah
Electrical Engrg. Dept. &
Material Science and Engrg. Dept.
122 S. Central Campus Dr., Rm 304
Salt Lake City, UT 84112-0560
Tel: (801) 587-7718 • Fax: (801) 581-4816
E-mail: Mark.Miller@ece.utah.edu
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2003
DRC TECHNICAL PROGRAM COMMITTEE
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Bobby
Brar, Rockwell Scientific Company; Andy Bryant, IBM;
Jeff Casady, Mississippi State University; Kent Choquette,
University of Illinois; Kristin de Meyer, IMEC; Jamal
Deen, McMaster University; Augusto Gutierrez-Aitken, TRW;
Fumio Koyama, Tokyo Institute of Technology; Lynn Loo, University
of Texas; Theresa Mayer, Penn State University; Arto
Nurmikko, Brown University; Leonard Franklin Register II
(Frank), University of Texas; Tetsuya Suemitsu, MIT;
Joerg Schulze, University of the German Federal Armed Forces;
Jimmy Xu, Brown University; Bin Yu, Advanced Micro Devices
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